Company Milestones
2025
- Vertical Continuous Copper Plating Equipment for laser-filled vias
- Ultrasonic deburr machine
- Automatic Impedance Tester
2023
- Moved into new site, total floor area 20,000 m²
- Installed new equipment
- Automated plating lines
- LDI (Laser Direct Imaging)
- DI (Direct Imaging)
- Mitsubishi 6th generation laser drilling machine
- Lamination reflow line
2021
- Construction of the new site has started, with a total floor area of 20,000 m².
2020
- CAM tool upgraded from Orbotech InCAM to Orbotech InCAM Pro
- Developed automated alignment functions for flexible and rigid-flex boards
2019
- Speedy Circuits was certified with AS9100D quality management system that is a widely adopted for the Aviation and national defense industry
2017
- Developed Coin embedded technology(U-,T- and I- coin) for thermal dissipation on 5G communication network devices.
2015~2016
- PerFix200 Automated Optical Rework (AOR)
- LPKF Microline 6000p UV laser cutting machine
- Vacuum resin plugging machine
- CCD alignment V-Cut equipment
2012~2014
- Employed Direct Laser Drill and achieved any-layer interstitial via hole (ALIVH) in HDI fabrication
- Developed multilayer flexible PCB technique
- Introduce Orbotech InCAM systems and enhance our CAM capability for HDI design and IC packaging.
2007~2011
- Added a new gold plating line (ImmAu, hard gold, soft bondable gold)
- Developed 4+N+4 HDI boards
- Renewed ISO9001: 2008 NSF-ISR Certificate.
- Provide PCB assembly services
- Successfully built up Metal core and flexible and Rigid-flex PCBs.
1999~2006
- Increased our workforce to 250 from 100 staff member.
- Achieved high aspect ratio of 15:1.
- Developed 2+N+2 HDI boards.
- Awarded ISO9001 NSF-ISR certificate.
- UL registered Successfully.
1996
- Established Speedy Circuits as a "quickturn" PCB prototyping services firm.
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